International Master's Program in Semiconductor Engineering
Introduction
Feng Chia University has established an International Master’s Program in Semiconductor Technology in collaboration with Siliconware Precision Industries Co., Ltd. (SPIL). Through jointly designed and customized curricula, the program aims to foster high-level engineering talent for the semiconductor industry. Building upon the core strengths of the Department of Mechanical and Computer-Aided Engineering, the program integrates academic training with industrial practice. During their second year of study, students have the opportunity to undertake professional internships at SPIL, enabling them to enhance their technical competencies through hands-on industrial experience and preparing them to meet the future workforce needs of the semiconductor sector.
SPIL is a global leader in integrated circuit (IC) packaging and testing services. Its primary business focuses on the manufacturing, processing, sales, and testing of a wide range of IC packaging solutions. The company supplies packaging and testing solutions that are widely used in personal computers, communication devices, commercial and consumer electronics, and memory-related applications.
SPIL remains committed to advancing technologies in advanced packaging, testing, and wafer bumping, and to strengthening resource integration to offer customers comprehensive one-stop semiconductor backend services. In recent years, the company has actively expanded into cutting-edge areas such as fan-out wafer-level packaging, system-in-package (SiP), 2.5D IC packaging, high-bandwidth packaging, and heterogeneous integration. With established production capacity and mass-manufacturing readiness, SPIL has secured a competitive position in advanced packaging services. The company also excels in operational flexibility, maintains a robust financial structure, and demonstrates strong technological capability and consistently high yields. SPIL operates global service locations in Taiwan, the United States, Europe, Japan, Singapore, and Suzhou, China, providing comprehensive support to customers worldwide.
Courses
● Introduction to Semiconductor Manufacturing Processes, Advanced Fluid Mechanics, Solid-State Diffusion, Vacuum Technology for Semiconductor Process Equipment, Advanced Physical Chemistry, Advanced Materials and Additive Manufacturing Technologies, Seminar and Professional Internship.
● Students must complete 32 credits to graduate.
● The program is conducted entirely in English.
Applicant’s Eligibility
English proficiency certificate/proof required:
At or above CEFR B1 (Threshold), TOEFL iBT 57, IELTS 4, TOEIC 550
Chinese proficiency certificate/proof required:
Listening and Reading at least at level A2 before the end of the first semester of the second year
Graduation Threshold
1. Graduation Requirements:
Students are required to complete a total of 32 credits, consisting of 2 credits of compulsory coursework and 30 credits of elective courses, which include 18 credits of professional internship.
2. Language of Instruction:
The program is delivered in English, ensuring an international learning environment and professional-level academic training.
3. Thesis Requirement:
In place of a traditional master’s thesis, students may submit a Technical Report. The report must address topics related to semiconductor manufacturing processes, mechanical engineering, smart manufacturing, computer-aided engineering, product testing, or carbon-reduction technologies. Completion of the required professional internship and successful passage of the Master’s Degree Examination are mandatory for graduation.
Employment Obligation after Graduation
Students admitted to the program receive financial support from both the government and Siliconware Precision Industries Co., Ltd. (SPIL) during their period of study. Upon graduation, recipients are required to fulfill a post-graduation employment commitment in Taiwan, with the service period equivalent to the duration of the living stipend provided by SPIL. Specifically, students who receive two years of SPIL living allowances are obligated to complete two years (24 months) of employment at SPIL after graduation.
Information for the Industry-Academic Scholarship
1. The funding for the Industry-Academic Scholarship includes National Development Fund of Executive Yuan and the SPIL:
(1) Necessary administrative expenses for students’ first arrival in Taiwan (receipt attached for the reimbursement, with a maximum of NTD. 10,000): The fees are sponsored by the National Development Fund of Executive Yuan, including Health examination fees prior to arrival in Taiwan, Visa fees, and documents verification fee.
(2) One-way flight to Taiwan: Provided by the National Development Fund of the Executive Yuan, with a maximum limit of NT$9,000 for an economy class one-way ticket on direct flights.
(3) Tuition and miscellaneous fees (up to 2 years): Provided by the National Development Fund of the Executive Yuan, the subsidy is limited to a maximum of NT$50,000 per semester. Eligible students will receive the subsidy during their first year of enrollment. Continuation of the subsidy into the second year is conditional: before the end of the first semester of the second year, students must achieve TOCFL Level 2 (A2) or above in both Listening and Reading, and pass a review of academic performance evaluation conducted by the Feng Chia University and SPIL.
(4) Monthly living allowance of NTD. 10,000 (up to 2 years): Provided by SPIL.
(5) Internship allowance during the internship periods : high or equal to the basic wage in Taiwan.
2. Industry-academia scholarship repayment principles:
(1) If a student withdraws from the INTENSE program due to personal reasons during their studies, such as transferring to another school, changing majors, taking a leave of absence to return home, and after counseling from the school still decides not to continue the program or is expelled from the school according to the regulations, the student shall fully repay the received industry-academia scholarship.
(2) If a student performs poorly academically, fails to meet the assessment standards of the school and SPIL, and after counseling from the school shows no improvement and is subsequently expelled from the school according to the regulations, the student shall fully repay the received industry-academia scholarship.
(3) If a student chooses not to work in a SPIL after graduation, the student shall fully repay the received industry-academia scholarship.
(4) If a student violates SPIL regulations and has their employment contract terminated legally after graduation, the student shall repay the industry-academia scholarship proportionally based on the number of months not employed; if less than one month, it shall be counted as one month.
(5) If a student does not work for the SPIL for the entire period covered by the industry-academia scholarship: the student shall repay the industry-academia scholarship proportionally based on the number of months not employed; if less than one month, it shall be counted as one month.
Living and Internship allowances
The SPIL provides the students the allowances, including the living allowance (NT$10,000 per person per month) and the internship allowance during the internship periods (high or equal to the basic wage NT$ 27400 per person per month in Taiwan).